Notification 810 - The value is outside allowed range

CATEGORY

ISSUE / RESULT

FIX / REFERENCE(S)

Information

The identified value is less or greater than the limit allowed for that input variable. This range is a practical design limits, or device specification limits, and cannot be altered.

  • Increase or decrease the identified input value.

  • Refer to the table below.

 

PCB Constructions (vertical / stack dimension)

‘Layer of copper’ is a technologically connected copper material (1oz,2,oz…) to a nonconductive plate (FR4).

The copper is etched to tracks, areas and pads. Some pads or areas could be drilled to provide a hole for components pins. When the internal side of the hole is plated for connecting 2 or more copper layers, they are called VIA.

The PCBs could have ONE or any bigger even number of layers 2, 4, 6, 8, 10, 12... 

Planar Magnetics PCBs

In the planar magnetics, mostly the internal layers are used. Creepage and clearance requirements for the internal layers are much smaller than the one for the top and bottom layers.

External pins are exposed externally for the transformer and creepage and clearance requirements apply to the core.

Any other number of a winding turns than ONE, needs minimum of 2 layers to take the lead out.

Winding TURNS Min layers L1 Turns L2 Turns Example

1 turn

1

1

-

2 turns and more

2

2

0, Return lead
 

 

1

1

  
 

 

0, In Lead

2

  

Table 1 Turns in layer

PCB Constants and internal construction

The PCB Enclosure technology constants are shown here for the user inspection.

Those are the minimum design rule values:

-          Minimum Distance Track to Track

-          Minimum Distance Track to Core (internal and external to the spiral)

and internal checks for minimum Trace Width.

 

Those values are function of TT (Track Thickness). Copper ounces used in the layer.

Cu
 Weight

 Copper thickness Min. Space between Copper Features Minimum
 Trace width		 Solder mask
 thickness

Ounces

μm

μm

mm

mm

1

35

89

0.09

0.08

2

70

203

0.20

0.08

3

105

254

0.25

0.08

4

140

0.355

0.35

0.08

5

175

 

0.43

0.08

6

210

 

0.51

0.08

7

245

 

0.59

0.08

8

280

 

0.68

0.08

9

315

 

0.76

0.08

10

350

 

0.84

0.08

Table 2 PCB Internal Properties Dimensions (Technology Tables) position

Prepregs

Thickness

Final

Types

μm

μm

1080

75

71.25

2116

105

99.75

7628

185

175.75

7628R

216

205.2

Table 3 Prepreg thickness

0.1

0.13

0.21

0.25

0.36

0.5

0.71

1

1.2

1.6

2

2.4

3.2

Table 4 FR4 Cores Thickness, mm

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

1

1.2

1.5

1.8

2.0

2.3

2.6

3.0

3.5

Table 5 PADS Drill holes, mm

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

1

Table 6 VIA Drill holes, mm

0.25

0.35

0.5

Table 7 Metallization Thickness. mm