Notification 182 - K-package power is based on IR reflow

CATEGORY

ISSUE / RESULT

FIX / REFERENCE(S)

Information

The power capability of PI device is assuming that IR reflow soldering is used. If Wave soldering is used, use derated power capability, equal to those used in V package (for TOPSwitch-JX).

  • Verify soldering technique and derate if necessary or design using V package

 

IR reflow technique guarantees that the tab of the device is soldered to a copper area on the board providing an additional path for heat flow and thereby lowering thermal resistance. The heatsink area calculation in PI expert assumes this lower thermal resistance while recommending the size of area for heatsinking.